The Lowest Variation Electroless Nickle Immersion Gold Means Reduced Costs and High Reliability

MacDermid Enthone’s Affinity ENIG 2.0 is a highly stable, low corrosion electroless nickel / immersion gold process developed with the needs of OEMs and quality engineers in mind. The benefits of Affinity ENIG 2.0 come from its highly tightened process variation compared to competing processes. Low variation means  savings due to reduced gold plating consumption.

 

Affinity ENIG 2.0 is the result of developments in leading ENIG technologies from our newly integrated companies combined with new innovations from our experienced plating staff experts.

  • Yield increases, in all aspects of the ENIG process
  • Dummy free at startup and during operation
  • Temperature resistant EN with tight phosphorous control
  • Highly reduced variation - every pad is the same
  • Savings on gold costs due to tight plating window

Reduction of Corrosion for Reliability

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In the decades that ENIG has existed as a high performance final finish alternative, it has been vulnerable to corrosion defects due to the nickel-gold replacement reaction. This is caused by non-uniform plating in the nickel and gold baths and wide variation in the chemical operation.


Each process step of Affinity ENIG 2.0 has been optimized to work together to create an extremely uniform nickel-phosphorous distribution and low variation in pad-to-pad gold thickness. As a result – the entire process is highly resistant to penetrating corrosion and conforms easily to all known specifications including the stringent new IPC 4552.

Tight Nickel-Phosphorous Percent Distribution

Consistency is everything. Affinity ENIG 2.0 comes with one of the most advanced electroless nickel baths sold for electronics manufacturing. The temperature resistant stabilizer and dummy free operation allow for savings in operating costs. The highly uniform phosphorous content prevents catastrophic failures in reliability of soldered components.

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Cost Savings from Tighter Gold Window and Dummy Free Operation

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The minimum specification called for by the IPC for ENIG gold thickness is 1.6 microinches. This means that a defect free process will be operated with a targeted mean plating thickness of 1.6 microinches plus four standard deviations to ensure that all parts coming out of the process are within. Anything less, and the line will begin to regularly produce scrap panels. Formulated to work together, the electroless nickel and immersion gold baths of Affinity ENIG 2.0 are able to produce a process with a standard deviation in gold thickness far below that of any competing system.

This means that once you make the switch to Affinity ENIG 2.0, every single panel produced from the line will require less gold consumption than before.

An ENIG Bath Developed With Six Sigma In Mind

The difficulty of an electroless nickel / immersion gold process is in its complexity. The multiple pre-treatment steps, plating steps and process control levers to consider are the reason why ENIG has been a historically difficult process to handle. Affinity ENIG 2.0 was developed using process control methodology and the result is a more streamlined, capable, and easier to use final finish that meets all surface finishing requirements when operated as intended.