The minimum specification called for by the IPC for ENIG gold thickness is 1.6 microinches. This means that a defect free process will be operated with a targeted mean plating thickness of 1.6 microinches plus four standard deviations to ensure that all parts coming out of the process are within. Anything less, and the line will begin to regularly produce scrap panels. Formulated to work together, the electroless nickel and immersion gold baths of Affinity ENIG 2.0 are able to produce a process with a standard deviation in gold thickness far below that of any competing system.
This means that once you make the switch to Affinity ENIG 2.0, every single panel produced from the line will require less gold consumption than before.