Nickel Plating

LECTRO-NIC Sulfamate Nickel processes are engineered for high-speed, reel-to-reel applications. The processes are specially formulated for connectors, leadframes and a variety of semiconductor devices. LECTRO-NIC OXR-1300 is specially formulated to prevent discoloration of plated STANNOSTAR pure tin deposits during reflow and high temperature thermal bake conditions. LECTRO-NIC 10-03 HSX is a sulfamate type nickel electroplating formulation specifically designed for high speed plating in reel-to-reel equipment using soluble anodes.

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Tin and Tin-Lead Plating

Our pure tin and tin-lead processes are engineered for both rack and barrel plating systems. The whisker-resistant, extremely versatile processes provide very bright, consistent deposits over a wide current density range.

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MacDermid Enthone Electronics Solutions appoints Mr. Roger Fontaine to Eastern Region Commercial Team Jun 18, 2018, 4:17 PM

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MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

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MacDermid Enthone Electronics Solutions to Exhibit at Productronica 2017 Oct 12, 2017, 2:55 PM

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