STANNOSTAR HMB is a fluoborate-free, low foaming tin-lead plating process. Formaldehyde-free, it is specially formulated for rack and barrel plating to produce bright tin-lead deposits.Read More
STANNOSTAR HMM-1000 is an MSA-based, fluoborate-free, pure tin plating process designed for deposition of reflowable, pure tin in medium and high speed equipment. The process produces matte to semi-bright pure tin deposits without oiling out of the organic compounds.Read More
STANNOSTAR Pure Tin Processes are specially designed for rack and barrel plating systems. The extremely versatile and robust processes rates are exceptionally well suited for plating parts with complex geometries, including electronic housings and connectors.Read More
StanTek tin and tin alloy processes are designed for a wide variety of electronic applications. In both rack and barrel and high-speed environments, our processes deliver against our customers’ most critical performance criteria. Durability in Pb-free environments, exceptional plating range, ease of use, and consistent solderability are reliably delivered by our processes. Beyond tin and tin/lead plating chemistries, we offer a full line of pre and post-treatment products. Long recognized as a leader in processes for the treatment, surface preparation, and finishing of metals, our cleaners and activators will assure a quality finish for your electronic components.Read More
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