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Our pure tin and tin-lead processes are engineered for both rack and barrel plating systems. The whisker-resistant, extremely versatile processes provide very bright, consistent deposits over a wide current density range.


STANNOSTAR HMB is a fluoborate-free, low foaming tin-lead plating process. Formaldehyde-free, it is specially formulated for rack and barrel plating to produce bright tin-lead deposits.

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STANNOSTAR HMM-1000 is an MSA-based, fluoborate-free, pure tin plating process designed for deposition of reflowable, pure tin in medium and high speed equipment. The process produces matte to semi-bright pure tin deposits without oiling out of the organic compounds.

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STANNOSTAR Pure Tin Processes are specially designed for rack and barrel plating systems. The extremely versatile and robust processes rates are exceptionally well suited for plating parts with complex geometries, including electronic housings and connectors.

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StanTek tin and tin alloy processes are designed for a wide variety of electronic applications. In both rack and barrel and high-speed environments, our processes deliver against our customers’ most critical performance criteria. Durability in Pb-free environments, exceptional plating range, ease of use, and consistent solderability are reliably delivered by our processes. Beyond tin and tin/lead plating chemistries, we offer a full line of pre and post-treatment products. Long recognized as a leader in processes for the treatment, surface preparation, and finishing of metals, our cleaners and activators will assure a quality finish for your electronic components.

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Product Release: MacuSpec THF 100 Mar 31, 2020, 1:45 PM

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MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM

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MacDermid Alpha Releases First Processes in New Memory Disk Product Line: Enklad Pretreatment Jan 22, 2020, 11:42 AM

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