The World's Largest Manufacturer of Electroless Nickel Chemistry for Memory Disk Applications

Over the past 30 years, we have delivered cutting-edge electroless nickel chemistry to the memory disk industry. We have strived to meet and exceed the rigorous product requirements required by disk manufacturers.

Due to our many years of experience, we are able to offer a total line of pre-treatment and electroless nickel chemistries. By providing a full product line, our customers benefit from an optimized process that produces memory disks of the highest quality.

All of our electroless nickel and pre-treatment chemistries are RoHS compliant.

Electroless Nickel Products

Our electroless nickel chemistries for Memory Disk produce high % phosphorous deposits with superior corrosion resistance and excellent thermal magnetic stability.  All of our electroelss nickel products yield deposits with low LZT and other micro-defects as well. Our electroless nickel products offer the unique ability to operate at high metal turnover, which significantly reduces our customers waste streams.  

General Properties
Nickel Content 88-89% w/w
Phosphorous Content >12% w/w
Magnetic Properties Non-Magnetic
Hardness 600 VHN
Operating Temp °F 87-90 ºC (188-194 °F)
Operating pH 4.40-4.80
Plating Rate 3.5 - 4.5 µ"/min


Enklad Pretreatment

Enklad Cleaner-Etch 100

The Enklad Cleaner-Etch 100 incorporates chemistry that combines both substrate cleaning and etching in one step. When compared to the industry standard equivalent, it produces less pitting in the aluminum substrate with a more uniform and mild etching while also preparing the disk surface for the zincate. The low foaming formulation allows for ease of production and its higher cloud point ensures a wide operating window.

Enklad Zincate 100/100R

Conventional zincate solutions are ineffective in meeting the demands of increased production volume as well as the variability of aluminum substrates currently being plated. The Enklad Zincate 100/100R overcomes a variety of issues associated with these different aluminum substrates. It deposits a thinner and more uniform zincate coating with exceptional adhesion to the aluminum surface in two steps. The second step also has the added benefit of a lower risk of drag-out contamination of the subsequent electroless nickel bath, improving process control and reducing risk.