Expand Your Design Palette, Expand Your Opportunities.

Molded Interconnect Devices (MID) are rapidly expanding into new and exciting areas in electronics applications. Once a mainstay in mobile devices, increasing opportunities are now spreading within the medical, automotive, and lighting industries. As these opportunities expand, new materials are being considered to address physical properties and costs related to the application.

Our MID plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. Delivering consistent selectivity on a wide variety of materials and catalysts, our copper, nickel, gold, and silver plating solutions enable more complex and efficient designs on the most desirable and low cost molding composites. Simple and controllable processes result in steady plating rates coupled with long and predictable bath performance.

Count on us for reliably high plating yields on current and evolving MID designs.

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  • Unmatched selectivity on laser direct structured materials
  • Highest yields on all current andemerging plastics
  • Stable, long-lasting, easy-to-usechemical processes
  • High tech applications in fine pitchplating and wire bonding

Copper Plating

MID Copper 100: This industry-leading electroless copper chemistry enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper will provide unmatched yields and high plating rates from a chemical process with exceptional stability.

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Final Finishing

MID Nickel 100: Low, Medium, and High Phosphorus nickel systems, all with exceptional stability. Each process will provide best in thickness uniformity combined with corrosion and salt spray resistance.

MID Silver 100: Our newest MID process, MID Silver 100 provides a complete and compelling alternative to nickel+gold as a final finish. Designers and manufacturers can realize significant cost reduction through gold elimination, elimination of nickel, and exceptional electrical performance. Our unique technology will assure environmental/corrosion resistance to meet end use requirements.

MID Gold 100: Designed to operate at low metal concentrations, this MID specific process will allow manufacturers to lower operating costs. Deposits exhibit exceptional solderability, contact resistance, and color uniformity.


Innovative MID Plating Solutions - A high reliability wire bonding technique that can be specifically applied to the rough MID surface to allow for consistent and successful gold thermosonic wire bonding to MID parts.


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