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Plating high aspect ratio through holes, conformal plated blind microvias and stacked filled vias for build up technology are just some of the challenges of the PWB manufacturing environment. The reliability of these constructions is only as good as the copper plating within them. Today’s requirements call for higher standards of mechanical properties, process control and flexibility. The product chosen must fit the end application.

We have a core competency in acid copper and house a full portfolio of acid copper products to meet all end user applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias. We also have specialized applications such as electroplated tin etch resist processes.

Through Hole Plating

We offer a variety of through hole metallization processes able to accomodate any challenge. Our Direct Current offerings include the HiSpec 2, HT 200, HT 300, HT 360, ST-2000 processes. Our Pulse plating type offerings include the MacuSpec PPR 100, PPR 200, and the PC 600 series baths. Whether it is lower thickness and high production volume or advanced high aspect ratio boards, we have a through hole plating process capable of producing Copper metallization of extremely high quality and reliability.

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Copper Via Fill

The MacuSpec VF, AVF, and VF-TH Series are production-proven processes that are specifically engineered to fill blind micro vias with select processes also able to simultaneously plate through holes in the same bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, process options are available that can eliminate flash plate and pre-dip steps as well as other processing hurdles for greater application flexibility, while increasing overall bath life substantially.

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IN THE NEWS

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MacDermid Alpha to Present at IMPACT-IAAC 2019 Conference Oct 3, 2019, 4:35 PM

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MACDERMID ALPHA ANNOUNCES RELEASE OF MACUSPEC HT 300 Oct 1, 2019, 2:11 PM

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MacDermid Alpha to Present at IMAPS International Symposium on Microelectronics 2019 Sep 24, 2019, 4:45 PM

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