Through Hole Plating
We offer a variety of through hole metallization processes able to accomodate any challenge. Our Direct Current offerings include the HiSpec 2, HT 200, HT 300, HT 360, ST-2000 processes. Our Pulse plating type offerings include the MacuSpec PPR 100, PPR 200, and the PC 600 series baths. Whether it is lower thickness and high production volume or advanced high aspect ratio boards, we have a through hole plating process capable of producing Copper metallization of extremely high quality and reliability.Read More
Copper Via Fill
The MacuSpec VF, AVF, and VF-TH Series are production-proven processes that are specifically engineered to fill blind micro vias with select processes also able to simultaneously plate through holes in the same bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, process options are available that can eliminate flash plate and pre-dip steps as well as other processing hurdles for greater application flexibility, while increasing overall bath life substantially.Read More
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