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Plating high aspect ratio through holes, conformal plated blind microvias and stacked filled vias for build up technology are just some of the challenges of the PWB manufacturing environment. The reliability of these constructions is only as good as the copper plating within them. Today’s requirements call for higher standards of mechanical properties, process control and flexibility. The product chosen must fit the end application.

MacDermid Enthone has a core competency in acid copper and has developed a full portfolio of acid copper products to meet all end user applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias. We also have specialized applications such as electroplated tin etch resist processes.

Through Hole Plating

MacDermid Enthone Electronics Solutions offers a variety of through hole metallization processes able to accomodate any challenge. Our Direct Current offerings include HiSpec 2, HT-200, HT-300, ST-2000 and our Pulse plating type offerings include the MacuSpec PPR 100, PPR 100, and the PC 600 series baths. Whether it is lower thickness and high production volume or advanced high aspect ratio boards, we have a through hole plating process capable of producing Copper metallization of extremely high quality and reliability.

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Copper Via Fill

The MacuSpec VF, AVF, and VF-TH Series are production-proven processes that are specifically engineered to fill blind micro vias with select processes also able to simultaneously plate through holes in the same bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, process options are available that can eliminate flash plate and pre-dip steps as well as other processing hurdles for greater application flexibility, while increasing overall bath life substantially.

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Copper Through Hole Fill

MacDermid Enthone Systek THF is a new generation copper through hole filling process that eliminates the need for complex and unreliable conductive paste and copper coin designs in your IC packaging builds. A two step process that includes a bridging step that is able to close a wide range of through holes, followed by a highly advanced via filling step create a filled copper through hole with exceptional thermal and electrical properties. With Systek THF, a new age of high density circuit designs and high power thermal management has begun.

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IN THE NEWS

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MacDermid Enthone Electronics Solutions appoints Mr. Roger Fontaine to Eastern Region Commercial Team Jun 18, 2018, 4:17 PM

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MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

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MacDermid Enthone Electronics Solutions to Exhibit at Productronica 2017 Oct 12, 2017, 2:55 PM

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