Through Hole Plating
We offer a variety of through hole metallization processes able to accomodate any challenge. Our Direct Current offerings include the HiSpec 2, HT 200, HT 300, HT 360, ST-2000 processes. Our Pulse plating type offerings include the MacuSpec PPR 100, PPR 200, and the PC 600 series baths. Whether it is lower thickness and high production volume or advanced high aspect ratio boards, we have a through hole plating process capable of producing Copper metallization of extremely high quality and reliability.Read More
Copper Via Fill
The MacuSpec VF, AVF, and VF-TH Series are production-proven processes that are specifically engineered to fill blind micro vias with select processes also able to simultaneously plate through holes in the same bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, process options are available that can eliminate flash plate and pre-dip steps as well as other processing hurdles for greater application flexibility, while increasing overall bath life substantially.Read More
MacDermid Enthone’s Marketing and OEM teams work very closely with the worldwide leaders in Automotive Electronics and Instrumentation to provide consistent and reliably effective…
The personal computer industry has seen increases in competition over the last 5 years. The market definition of computers includes desktops, laptops and more recently netbooks.
The communications market has seen significant changes over the last decade. This market is growing rapidly and incorporating more technical changes than any other market.…