Plating high aspect ratio through holes, conformal plated blind microvias and stacked filled vias for build up technology are just some of the challenges of the PWB manufacturing environment. The reliability of these constructions is only as good as the copper plating within them. Today’s requirements call for higher standards of mechanical properties, process control and flexibility. The product chosen must fit the end application.

MacDermid Enthone has a core competency in acid copper and has developed a full portfolio of acid copper products to meet all end user applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias. We also have specialized applications such as electroplated tin etch resist processes.

Hoist and Vertical Continuous Plating

Vertical Continuous Plating Systems deliver high productivity through increased automation and increased plating current density while improving plating performance. Choosing the proper product for the equipment set is as important as choosing the equipment.

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Vertical Electroplate

MacuSpec VF Series is a unique, production-proven process that is specifically engineered to be the most effective method to simultaneously plate through holes and fill blind microvias in one bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, it eliminates an entire process sequence for greater application flexibility, while increasing overall bath life 400%.

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MEES to Present Three Papers at SMTA International Sep 11, 2017, 10:51 AM

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MEES to Showcase at SMTA International 2017 Aug 30, 2017, 2:05 PM

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Compugraphics Receives Supplier of the Year Award by FUJIFILM Dimatix Jul 26, 2017, 5:07 PM

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