MacuSpec HT 200
MacuSpec HT 200 has been specifically formulated for providing higher microdistribution at higher current densities, which makes it an excellent product choice for continuous vertical platers. The MacuSpec HT 200 acid copper system deposits a bright, smooth, ductile copper deposit within a current density range of 5 to 30 ASF. The mechanical properties of the plated deposit exceed IPC specifications across the entire current density range and HT 200 is capable of plating through holes up to an aspect ratio of 10:1.
MacuSpec HT 300
MacuSpec HT 300 is the next generation ultra-performance direct current copper plating solution for plating higher technology multi-layer through holes. HT 300 maintains excellent microdistribution with industry leading performance at higher current densities for through holes with aspect ratio of up to 15:1. The MacuSpec HT 300 has an exceptionaly wide current density range of 5 to 35 ASF for plating high aspect ratio panels with a bright surface finish. MacuSpec HT 300 bath is fully analyzable by CVS and common analytical tools, making it the only choice for ensuring high yields and process stability while creating high tech multilayer printed circuit boards at breakneck speed. The deposit produced by MacuSpec HT 360 passes all specifications required for high volume multilayer board production including IPC 6012D, 6013D and 6012DS Tensile and Elongation Requirement 220.127.116.11.
MacuSpec HT 360
MacuSpec HT 360 is a state of the art direct current acid copper plating process that provides throwing powers of greater than 80% at current densities of up to 30 ASF in through holes with aspect ratios of up to 8:1. . The chemistry quickly plates a uniform thickness in the through hole, preventing extra thickness of wasted copper on the surface of the panel without the need for expensive pulse rectifiers.
The MacuSpec HT 360 deposits exceed IPC Class 3A tensile strength and elongation requirements and pass all thermal reliability testing ensuring dependable device performance. The MacuSpec HT 360 components are fully analyzable by CVS, providing ease of control and trouble-free operation throughout the solution life.
The HiSpec2 Acid Copper Process is a unique acid copper plating system designed primarily for high aspect ratio PWB production. The highly stable, low organic additive system combined with a high free acid to copper ratio electrolyte, provides for twice the macro throwing power of conventional acid copper processes. In addition, HiSpec2 produces semi-bright, fine grained, ductile copper deposits over the extreme low to medium current density range 1 - 30 ASF with unparalleled uniformity of deposit properties. Great deposit quality and excellent distribution across the PWB surface and holes are achieved.
ST-2000 is a direct current acid copper system designed to meet the surface distribution, throwing power and thermal reliability requirements of today’s printed circuit boards (PCBs), including high aspect ratio through-hole and microvia designs. The ST-2000 system combines high current density capability with exceptional surface distribution and throwing power.