The MacuSpec AVF-700 is an advanced via fill copper metallization that our customers building HDI choose when they need minimal surface copper under a wide variety of aspect ratios. The unique formula of chemical components and equipment parameters enables customers to plate a wide variety of blind micro via sizes in just one bath without the need of flash plate and the ability to use direct metallization solutions.
Reliable, High Quality Copper Vias, Every Single Time
MacuSpec AVF-700 is the result of combining the industry experience of MacDermid Enthone's highly specialized staff and technologies. The filled micro vias created by AVF-700 have an extraordinary degree of repeatability while also adhering to IPC 6012D, 22.214.171.124 having a tensile strength no less than 36,000 PSI and enlogation no less than 12%. Improved copper on copper bonding provides reliability above and beyond that of what is expected from industry equivalents.