Via Filling Solutions for Any Metallization Challenge

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The MacuSpec VF, AVF, and VF-TH Series are production-proven processes that are specifically engineered to fill blind micro vias with select processes also able to simultaneously plate through holes in the same bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, process options are available that can eliminate flash plate and pre-dip steps as well as other processing hurdles for greater application flexibility, while increasing overall bath life substantially.

MacuSpec AVF-700

The MacuSpec AVF-700 is an advanced via fill copper metallization that our customers building HDI choose when they need minimal surface copper under a wide variety of aspect ratios. The unique formula of chemical components and equipment parameters enables customers to plate a wide variety of blind micro via sizes in just one bath without the need of flash plate and the ability to use direct metallization solutions.

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Reliable, High Quality Copper Vias, Every Single Time

MacuSpec AVF-700 is the result of combining the industry experience of MacDermid Enthone's highly specialized staff and technologies. The filled micro vias created by AVF-700 have an extraordinary degree of repeatability while also adhering to IPC 6012D, 3.2.6.2 having a tensile strength no less than 36,000 PSI and enlogation no less than 12%. Improved copper on copper bonding provides reliability above and beyond that of what is expected from industry equivalents.

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Key Features

  • Excellent via filling of vias up to 6 mils in diameter and 4 mils deep with minimum surface copper
  • Less / no copper reduction necessary after plating
  • Fully analyzable by CVS and common analytical tools
  • No flash plate required
  • Compatible with largest portfolio of direct metallization solutions available worldwide
  • Meets IPC specifications for copper deposit properties

MacuSpec VF-TH 200

When efficiency, reliability, and cost savings of through hole plating and via filling are the goal, MacDermid Enthone's MacuSpec VF-TH 200 is the choice our customers go to first. VF-TH 200 is able to simultaneously fill vias and plate through holes of up to 5:1 aspect ratio with electrolytic copper on a wide range of structure sizes with great physical properties. 

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Fewer Process Steps Without a Reduction in Reliability

MacuSpec VF-TH 200 reduces the need for a number of processing steps without reduction in reliability. The copper depsited from the VF-TH 200 bath has superior physical properties, passing IPC 6012D, DS, and 6013D - tensile strength no less than 40,000 PSI and elongation no less than 18%.

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Key Features

  • No predip required
  • Simultaneous filling of copper vias and plating of through holes
  • Specifically designed to excell at pattern plating applications such as  MSAP and SL-HDI
  • Fills 3x3 to 5x3 mil vias within 60 minutes with dimple of less than 10 microns
  • Fully analyzable by CVS and common analytical tools
  • Compatible with the largest portfolio of direct metallization solutions worldwide
  • Meets IPC specifications for copper deposit properties