MacuSpec VF-TH 200
When efficiency, reliability, and cost savings of through hole plating and via filling are the goal, MacDermid Enthone's MacuSpec VF-TH 200 is the choice our customers go to first. VF-TH 200 is able to simultaneously fill vias and plate through holes of up to 5:1 aspect ratio with electrolytic copper on a wide range of structure sizes with great physical properties.
Fewer Process Steps Without a Reduction in Reliability
MacuSpec VF-TH 200 reduces the need for a number of processing steps without reduction in reliability. The copper depsited from the VF-TH 200 bath has superior physical properties, passing IPC 6012D, DS, and 6013D - tensile strength no less than 40,000 PSI and elongation no less than 18%.