While circuit densities continue to shrink, board fabricators and end-users alike have demanded alternative surface finishes that combine high yields, low cost, increased functionality, and ease of fabrication and assembly. We have accepted the challenge. In keeping with our market served approach to the industry, we provide a full line of organic and metallic final finishes to meet a variety of customer needs.

Our core competency in surface preparation and plating processes has provided the basis for our offering of metallic final finishes. These finishes can be permanent, becoming an integral part of the assembled board, or sacrificial, preventing copper oxidation and preserving solderability through the assembly process. Years of proven results are one of the principle reasons why our Final Finishing products have become a critical part of many of the world's leading OEM electronics.

Immersion Tin

ORMECON CSN Classic is a series of extremely stable immersion tin processes. Based on a patented Organic Metal pre-dip, the tin processes are production-proven to reduce copper-tin diffusion speed by as much as 65% and catalyze the tin deposition. As a result, exceptional solderability and appearance, even after multiple lead-free assembly reflows, is achieved.

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Immersion Silver

Sterling is the #1 immersion silver surface finish, specified by hundreds of fabricators, assemblers and OEM’s worldwide to provide consistent solderability, low contact resistance, process simplicity, and long shelf life.

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Organic Solderability Preservative

ENTEK PLUS HT organic solderability preservative (OSP) is the industry’s most widely used and trusted OSP on the market today. Production-proven to provide a superlative lead-free final finish and maintain exceptional solderability through multiple lead-free processing, delivering the highest reliability BGA solder joint strengths.

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Electroless Nickel / Immersion Gold

MacDermid Enthone’s Affinity ENIG 2.0 is a highly stable, low corrosion electroless nickel / immersion gold process developed with the needs of OEMs and quality engineers in mind. The benefits of Affinity ENIG 2.0 come from its highly tightened process variation compared to competing processes. Low variation means savings due to reduced gold plating consumption.

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Electroless Nickel / Electroless / Palladium / Immersion Gold

MacDermid Enthone’s Affinity ENEPIG is the latest electroless nickel/electroless palladium/immersion gold plating process designed specifically to deliver a highreliability wire bondabale surface finish with high yields. By combining the advances of Affinity ENIG and a stable palladium plating step, this finish eliminates black line nickel associated with ENIG while delivering high reliablity. All this is done without the hassle of dual finishing.

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Technical Documents



Product Release: MacuSpec THF 100 Mar 31, 2020, 1:45 PM

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MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM

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MacDermid Alpha Releases First Processes in New Memory Disk Product Line: Enklad Pretreatment Jan 22, 2020, 11:42 AM

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