MacDermid Enthone is known as a leader in Final Finishes for the electronics industry. When it comes to reliability, stability, and high yield from a single plating process, request MacDermid Enthone's Affinity ENEPIG.
MacDermid Enthone’s Affinity ENEPIG delivers the wire bonding performance you need no matter what palladium thickness your application requires. With unmatched wire bondability our finish also maintains excellent solderability performance. Solder spread and solder joint integrity are not compromised even after various forms of heat and humidity conditioning. When it comes to process stability, performance reliability and high yields, from a single plating process, request MacDermid Enthone Affinity ENEPIG.