ENTEK PLUS HT
ENTEK PLUS HT organic solderability preservative (OSP) is the industry’s most widely used and trusted OSP on the market today. Production-proven to provide a superlative lead-free final finish and maintain exceptional solderability through multiple lead-free processing, delivering the highest reliability BGA solder joint strengths.
The ENTEK PLUS HT process meets the challenges of lead-free assembly, while maintaining eutectic and process capability. The process is specially designed for mixed metal applications, such as electroless nickel immersion gold (ENIG). The OSP selectively deposits on copper while leaving gold connectors or metallic heat sinks free of contamination.