Fully Integrated Processing

Integrated metallization systems are becoming more widely used in high density interconnection device designs, and we have complete portfolios of options for our customers. The SysteMac integrated metallization system is designed for low cost manufacturing of HDI structures and combines a horizontal desmear with innovative direct metallization and VCP electroplating baths. The Modified Semi-Additive Process is a cost effective, lean manufacturing process for creating very fine line structures for integrated metallization systems and includes everything from copper reduction of foil to final finishes for component mounting. See below for more information.

Systemac

Fully Automated Integrated Equipment/Chemical Metallization System for: Horizontal Desmear; Horizontal Direct Metallization; Vertical Continuous Electroplating. The benefits of synerfy; higher yields, less downtime, improved consistency, less material handling, chemical compatibility.

Read More

Modified Semi-Additive Process

MSAP is a cost effective process for fine line substrates which allows for a high degree of automation, high yields and lean manufacturing. MacDermid Alpha Electronics Solutions has a portfolio which encompasses every process step. Ask a MacDermid Alpha representative about MSAP today.

Read More

IN THE NEWS

Picture3.png

MACDERMID ALPHA ELECTRONICS SOLUTIONS TO EXHIBIT AT JAPAN’S 49TH INTERNATIONAL ELECTRONIC CIRCUITS EXHIBITION May 16, 2019, 11:37 AM

Read More
MContactIN2000_LinkedIn_5Apr2019.jpg

MACDERMID ALPHA ANNOUNCES THE RELEASE OF M-CONTACT IN-2000: REEL TO REEL INDIUM PLATING FOR PRESS-FIT CONNECTOR FINISHING Apr 5, 2019, 10:01 AM

Read More
Celltech_300x300_Proud-sponsors-MacDermid.jpg

MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

Read More

INDUSTRIES SERVED