Integrated metallization systems are becoming more widely used in high density interconnection device designs, and MacDermid Enthone has complete portfolios of options for our customers. The SysteMac integrated metallization system is designed for low cost manufacturing of HDI structures and combines a horizontal desmear with innovative direct metallization and VCP electroplating baths. The Modified Semi-Additive Process is a cost effective, lean manufacturing process for creating very fine line structures for integrated metallization systems and includes everything from copper reduction of foil to final finishes for component mounting. See below for more information.