Fully Integrated Processing

Integrated metallization systems are becoming more widely used in high density interconnection device designs, and MacDermid Enthone has complete portfolios of options for our customers. The SysteMac integrated metallization system is designed for low cost manufacturing of HDI structures and combines a horizontal desmear with innovative direct metallization and VCP electroplating baths. The Modified Semi-Additive Process is a cost effective, lean manufacturing process for creating very fine line structures for integrated metallization systems and includes everything from copper reduction of foil to final finishes for component mounting. See below for more information.

Systemac

Fully Automated Integrated Equipment/Chemical Metallization System for: Horizontal Desmear; Horizontal Direct Metallization; Vertical Continuous Electroplating. The benefits of synerfy; higher yields, less downtime, improved consistency, less material handling, chemical compatibility.

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Modified Semi-Additive Process

MSAP is a cost effective process for fine line substrates which allows for a high degree of automation, high yields and lean manufacturing. MacDermid Enthone Electronics Solutions has a portfolio which encompasses every process step. Ask a MacDermid Enthone representative about MSAP today.

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IN THE NEWS

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MacDermid Enthone Electronics Solutions appoints Mr. Roger Fontaine to Eastern Region Commercial Team Jun 18, 2018, 4:17 PM

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MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

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MacDermid Enthone Electronics Solutions to Exhibit at Productronica 2017 Oct 12, 2017, 2:55 PM

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