An Industry Leader in Metallization


Today's technical challenges of miniaturization, increased signal speed, advanced resin systems combined with higher reliability requirements place more emphasis on performance of all processes involved, and the foundation of success is reliable metallization.

From removing smear, to making through holes conductive, to plating the proper copper thickness in the holes as well as uniformity across the circuits, to filling blind microvias and plating a metallic etch resist, we have the right solution for the industry.

Our metallization technology group continues to research and develop new solutions to meet the ever changing manufacturing landscape ahead. Innovative solutions coupled with applications know how has made us an industry leader in the field.


Reliable, void free coverage starts with the proper desmear process. MacDermid Enthone's M-Permanganate desmear process, along with our patented permanganate regeneration system provides reliable desmear with maximum topography. The combination of reliable desmear and topography are prerequisites for subsequent metallizations steps that will ensure the best coverage and highest copper to resin adhesion values.

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Direct Plating

The demand for lower costs and more environmentally friendly processes has generated a need for alternatives to conventional electroless copper processing. We responded with the patented Blackhole direct plate technology. The Blackhole direct plate technology eliminates heavy metals, formaldehyde and cyanide, while reducing operating costs. This horizontal process makes through holes and blind vias conductive utilizing a carbon black technology. This carbon black technology allows electrolytic copper to plate directly to the interconnects, yielding high copper to copper adhesion.

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Horizontal Electroless Copper

MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price. M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations to allow for a revolution in quality and service in a segment of the PCB industry that rarely sees new offerings. Your OEM customers will feel more confident knowing that their products were assembled with a process backed by a world-class organization. With M Copper EF you can rest assured that you are using only the best electroless copper metallization available. Don’t fall into the trap of compromising quality for cost, with M-Copper EF, you can have it all.

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Vertical Electroless Copper

Electroless copper has been the manufacturing standard for over 30 years, and MacDermid Enthone has been there since the beginning. Early innovations led to the development of the M-System/M-85, our highly successful heavy deposition electroless copper process. For the past 20 years, this process has become the industry standard for void free coverage. Maintaining the patented pretreatment system, MacDermid Enthone has developed the M-Copper Omega process, which takes copper to copper adhesion to a new level.

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MacDermid Enthone Electronics Solutions appoints Mr. Roger Fontaine to Eastern Region Commercial Team Jun 18, 2018, 4:17 PM

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MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

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MacDermid Enthone Electronics Solutions to Exhibit at Productronica 2017 Oct 12, 2017, 2:55 PM

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