Reliable, void free coverage starts with the proper desmear process. MacDermid Enthone's M-Permanganate desmear process, along with our patented permanganate regeneration system provides reliable desmear with maximum topography. The combination of reliable desmear and topography are prerequisites for subsequent metallizations steps that will ensure the best coverage and highest copper to resin adhesion values.
A reliable Electroless Copper starts with a reliable desmeared hole as well as optimal topography generation. Advanced resin systems with higher functionalities makes the desmear process more difficult yet more critical.
MacDermid Enthone offers both Aqueous and non-aqueous swellers for all material types. Utilizing Design of Experiment methodology, we have developed an extensive library of desmear/topographic profiles for all commercially available materials. Availability in powdered permanganate as well as liquid permanganate offer flexibility in vertical or horizontal processing.