The demand for lower costs and more environmentally friendly processes has generated a need for alternatives to conventional electroless copper processing. MacDermid Enthone has a complete line of direct metallization solutions for substrates of all kinds. Blackhole direct plate technology eliminates heavy metals, formaldehyde and cyanide, while reducing operating costs. Shadow direct metallization is the choice for HDI and flex type constructions and allows for plating of complex thorugh holes in a simple and easy to controll process. Eclipse is the direct metallization choice which brings consistency, durability, and high reliability to OEMs at a low cost compared to that of conventional metallization. EVISION HDI is the conductive polymer based direct metallization process with a short, three step process that exceeds performance and reliability standards.

Shadow and Shadow V

Graphite Based Direct Metallization

Shadow Direct Metallization Process is a patented graphite based slightly alkaline aqueous dispersion of conductive colloids and proprietary additives used to make through-holes, and other vias, conductive for subsequent copper electroplating. Most suitable for HDI and Flex

  • Formaldehyde free and reduced water usage
  • Unsurpassed reliability verified with IST, HATS and Thermal cycling
  • No flash plate required when combined with copper via filling for improved production and cost
  • Copper-to-copper direct bonding strength and good reliability
  • No chelating agents and heavy metals.
  • Simple, easy to control process
  • Compatible with exotic materials like PI, LCP, Rigid flex and Teflon




Mission Critical PTH Reliability

MacDermid Enthone Eclipse is the next generation direct metallization process, engineered specifically for fabricators and OEMs that require consistently high performance, reliability and durability. Simpler to use and considerably more cost-efficient than electroless copper, Eclipse provides high tech capabilities and RoHS-compliance all in one.

The new benchmark in PTH metallization, carbon-based Eclipse features 10:1 aspect ratio and higher PTH capability, achieves over 500 IST cycles, and enables manufacturers to decrease chemical usage and water consumption by 90%. The new environment standard reduces process steps by 50% and eliminates 100% of chelated metals. Utilizing an automated horizontal process, Eclipse delivers unmatched coverage and connectivity for even the most challenging designs, and is supported by MacDermid Enthone's renowned hands-on global technical service.

The Most Reliable PTH Metallization Process for the Lowest Cost of Ownership

If you are looking for quantifiable reasons to switch from electroless copper to the industry's most environmentally-responsible and cost-efficient PTH metallization process, our revolutionary Eclipse formulation is your solution. Now you can dramatically reduce volatiles and waste pollutants, eliminate unwanted heavy metals and formaldehyde, and extend the life of your bath. All without sacrificing reliability and hole integrity, and at the lowest total cost. Guaranteed.


High Performance, High Production Capacity, Environmentally Friendly

Meeting the volume demand for PCBs and providing a greenr world are no longer incompatable goals. ENVISION HDI direct metallization system delivers more board capacity with substantially improved performance. The ENVISION HDI polymer-based system is unlike any other direct metallization process on the market today.

  • Low cost of ownership vs. electroless copper
  • Meets or exceeds performance and reliability standards
  • Delivers reliable processing of microvias and high asect ratio multilayers in a single pass
  • Short, three step process for high productivity
  • Reduces water usage, energy consumption and waste treatment vs. electroless copper


chart_rule4-costsavings.pngThe significant cost savings rendered from the replacement of electroless copper with ENVISION HDI are mainly comprised of lower material costs, labor costs (due to cycle tmie reduction and lower maintenance), lower equipment costs, lower utility costs, and more.

You no longer need to choose between high performance and cost reduction. You only need to choose ENVISION HDI.




The Lowest Cost Through Hole Metallization Process Available

MacDermid Enthone Blackhole is the choice of fabricators worldwide that prefer a low cost, environmentally friendly direct metallization alternative to electroless copper. Suitable for both simple and complex circuit boards, carbon-based Blackhole is a nanoscale electrostatic coating that satisfies every need for reliability and versatility.

Trusted by over 250 of the world’s leading manufacturers, Blackhole is an automated, horizontal process whose unique technology enables users to reduce cycle time, decrease overall water consumption, completely eliminate the use of formaldehyde, and produce less waste than electroless copper plating. 

PCB fabrication costs are the result of many factors: chemical consumption, waste production, engineering support, and process yield, among others. Blackhole provides a value in use which drops right to your bottom line minimizing costs associated with installation, operation and final product yield.

 Value-in-Use Cost Savings

Blackhole Savings Electroless Copper
2 to 3 min. Start-up Time: 97% Savings 90 min.
8 min. Cycle Time: 87% Savings 60 min.
7 mL/ssf Chemical Replenishment: 90% Savings 70 mL/ssf
6 L/min. Water Consumption: 88% Savings 50 L/min.
20 mL/ssf Water Waste Treatment: 90% Savings 200 mL/ssf