Maintaining The Patented Pretreatment System

Electroless copper has been the manufacturing standard for over 30 years, and MacDermid Enthone has been there since the beginning. Early innovations led to the development of the M-Systems/M-85, our highly successful heavy deposition electroless copper process. For the past 20 years, this process has become the industry standard for void free coverage. Maintaining the patented pretreatment system, MacDermid Enthone has developed the M-System Omega process, which takes copper to copper adhesion to a new level. The newly released M-Copper EF is the only electroless copper system on the market sold by a world class supplier which can outperform local suppliers on performance and price.

M-Copper EF

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MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price. M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations to allow for a revolution in quality and service in a segment of the PCB industry that rarely sees new offerings.

Your OEM customers will feel more confident knowing that their products were assembled with a process backed by a world-class organization. With M-Copper EF you can rest assured that you are using only the best electroless copper metallization available. Don’t fall into the trap of compromising quality for cost, with M-Copper EF, you can have it all.

M-Copper EF Key Features

  • Developed from a history of high reliability electroless copper
  • Statistically engineered to provide a robust operating window on modern materials
  • Lower cost without compromise of quality or service
  • Backed by the support and know-how of an international chemical supplier
  • Flexibility for customer-purchased commodity chemicals

M-System

M-System metallization process combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post pattern plate backlight performance. The statistically designed electroless copper bath, when used with enhanced solution transport will produce the highest yields on high aspect ratio holes and blind microvias.

The increased functionality of the newest resins systems present another set of challenges. Although the higher temperature resins meet designer specifications, they tend to be more chemically inert and more difficult to process. To meet these new processability and reliability benchmarks, MacDermid Enthone has developed a system to overcome these obstacles.

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M-System Omega

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The M-System Omega metallization process combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post pattern plate backlight performance. The statistically designed electroless copper bath, when used with enhanced solution transport will produce the highest yields on high aspect ratio holes and blind microvias.

The increased functionality of the newest resins systems present another set of challenges. Although the higher temperature resins meet designer specifications, they tend to be more chemically inert and more difficult to process. To meet these new processability and reliability benchmarks, MacDermid Enthone has developed a system to overcome these obstacles.

M-Copper 15

MacDermid Enthone M-Copper 15 is the thin deposition electroless copper developed specifically for fabricators that require process flexibility and reduced overall chemical costs in the development of their super thick circuit boards.

M-Copper 15, able to plate 15 microinches in 15 minutes, is impervious to bath loading and can be utilized in either basket mode or 1-up in-line for ultimate flexibility. With a load factor of 0.20 – 1.75 square feet per gallon, the reduced amount of chemicals used in the plating bath enables each shipment to last longer. Highly reliable, M-Copper 15 is engineered for low deposit stress, resulting in superior hole wall adhesion. It also features lower hydrogen evolution,which delivers a more uniform electroless copper deposition in the center of high aspect ratio holes. Using the same activation sequence as our renowned.

M-Copper 15 is the right choice for all of your highest technology circuit board projects.

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MultiFlex

MultiFlex is formaldehyde and cyanide-free electroless copper process. It provides the ultimate through-hole reliability and material compatibility superior coverage and adhesion with minimal waste.

MultiFlex Key Features

  • Compatible with all alkaline-sensitive materials
  • Direct copper-to-copper bonding improves reliability
  • No formaldehyde
  • Engineered for reliabilty and performance
  • Plates only non-conductive surfaces
  • Maximizes cost efficiency