Surface Treatments

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Electronic devices rely on a variety of high performance materials, joined together in strong systems according to intricate designs.  But everything falls apart if the joining surfaces are not perfectly conditioned.  Surfaces must be cleaned, etched, textured, coated, and bonded with atomic-scale precision.  MacDermid Enthone has the surface treatment systems to perform the most demanding functions for the highest level technological devices.  Please contact us if you have any questions or would like to learn more about our Surface Treatments.

Copper Roughness Reduction

MultiPrep 200 is a revolutionary pretreatment process for the adhesion of solder mask, dry film and liquid photoresists to copper surfaces. Leveraging decades of MacDermid Enthone etching experience, MultiPrep 200 is engineered to meet today's challenging adhesion requirements.

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Copper Surface Preparation

Surface Preparation Solutions for both innerlayer and outerlayer cleaning address the challenges confronted by PCB fabricators, including the complex processing of increased layer counts, as well as the demands posed by harsh mechanical cleaning methods.

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Innerlayer Bonding

The No-Risk Oxide Alternative From The Market Leader In Innerlayer Bonding MacDermid Enthone is a market leader in the development of high reliability bonding conversion coatings for Multilayer Printed Circuit Boards. The Process is the most widely used oxide alternative system in the world, with over 150 installations worldwide.

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Innerlayer Cleaners

CoreClean was developed as a flexible surface preparation process for inner layers prior to the application of either dry film or liquid resist. It includes cleaners capable of removing the most tenacious chromate, zincate, and silane anti-tarnish treatments, and can be used with or without a microetch, and with or without antitarnish as suits the needs of the user.

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Signal Integrity

MacDermid Enthone’s complete copper surface treatment process for fabrication of printed circuit boards in applications demanding the lowest signal loss. This uniquely formulated process, from the market leader of innerlayer technologies, provides low surface profiles and reliable adhesion for high frequency applications.

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IN THE NEWS

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MEES to Present Three Papers at SMTA International Sep 11, 2017, 10:51 AM

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MEES to Showcase at SMTA International 2017 Aug 30, 2017, 2:05 PM

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Compugraphics Receives Supplier of the Year Award by FUJIFILM Dimatix Jul 26, 2017, 5:07 PM

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