The next generation, MultiBond MP, is the ideal bonding process for controlled impedance inner layers. Up to a 80% reduction in concentrated copper waste compared with other systems. Low copper removal of 50 μ"; just one micron! This makes MultiBond MP the ideal bonding process for controlled impedance inner layers, and has proven compatibility with advanced resin systems.
MultiBond MP - multilayer bonding technology that builds winners
- Lowest copper removal
- Exceptional impedance control results
- Compatible with a full range of resins, including epoxies, polyimide, and hybrids
- Significant reduction reduction in copper waste volume
- Single proprietary replenisher
The OmniBond Plus+ process is the only production-proven oxide dissolution system offering pink ring elimination and greatly lower incidence of high-resistance shorts than DMAB reduced oxide. Both processes offer multi-resin compatibility for optimum process flexibility.