MultiBond

The No-Risk Oxide Alternative From The Market Leader In Innerlayer Bonding

MacDermid Enthone is a market leader in the development of high reliability bonding conversion coatings for Multilayer Printed Circuit Boards. The Process is the most widely used oxide alternative system in the world, with over 150 installations worldwide.

MultiBond Key Features

  • MultiBond is a uniquely formulated copper conversion coating for Multilayer Printed Circuit Boards, combining micro-roughening with an embedded organic coating
  • MultiBond is used in high throughput, automated horizontal conveyorized systems for fast, consistent “Steady-State” processing of thin core inner layers
  • Complete resin systems capability, including Polyimide, BT, Cyanate Ester, PPO, Teflon, High TG, High Speed/Low Loss, Halogen Free etc.
  • Compatible with high temperature “Lead Free” Assembly requirements
  • In addition to providing high reliability inner layer bonding on a wide variety of materials, MultiBond MP is also used to prepare copper surfaces for optimum effciency of CO2 Laser Direct drilling in the formation of micro-via holes
  • MultiBond process is ideally suited for mass production of high reliability, high layer count HDI Printed Circuit Boards

CO2 Laser Direct Drill Benefits

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100 micron Laser Direct Drill 
via hole, 12 micron copper

  • High throughput automated system with short process cycle times
  • Eliminates “etch down” process
  • Micro-roughening and organic coating creates the optimum copper surface for high efficiency absorption of Laser Direct Drill energy
  • Enables Laser Direct drill using 12 micron copper

MultiBond MP

The next generation, MultiBond MP, is the ideal bonding process for controlled impedance inner layers. Up to a 80% reduction in concentrated copper waste compared with other systems. Low copper removal of 50 μ"; just one micron! This makes MultiBond MP the ideal bonding process for controlled impedance inner layers, and has proven compatibility with advanced resin systems.

MultiBond MP - multilayer bonding technology that builds winners

  • Lowest copper removal
  • Exceptional impedance control results
  • Compatible with a full range of resins, including epoxies, polyimide, and hybrids
  • Significant reduction reduction in copper waste volume
  • Single proprietary replenisher

 

OmniBond Plus+

The OmniBond Plus+ process is the only production-proven oxide dissolution system offering pink ring elimination and greatly lower incidence of high-resistance shorts than DMAB reduced oxide. Both processes offer multi-resin compatibility for optimum process flexibility.