M-Speed Copper Treatments for High Speed Innerlayers

Our complete copper surface treatment process for fabrication of printed circuit boards in applications demanding the lowest signal loss. This uniquely formulated process, from the market leader of innerlayer technologies, provides low surface profles and reliable adhesion for high frequency applications. M-Speed provides low profle surface topography to ensure maximum signal speeds, meeting the needs of controlled impedance and perfect signal integrity. M-Speed ofers superior adhesion and maximum thermal resistance despite lower surface topography and lower peak to valley roughness

Key Features

  • Exceptional precision for controlled impedance and high frequency designs
  • Superior adhesion for imaging and immerlayer processing
  • Environmentally friendly
  • High reliability on conventional and new laminate systems
  • Low surface profiles

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The M-Speed system achieves this industry-leading performance in as few as three process steps. The process combines a holistic approach for dry flm adhesion and innerlayer bonding including clean, prep and oxide alternative post treatment. This surface allows excellent adhesion to a wide variety of photoresists as well as unparalleled innerlayer bonding strength. M-Speed provides fexibility of processing using environmentally friendly chemistry.