M-Speed Copper Treatments for High Speed Innerlayers

MacDermid Enthone’s complete copper surface treatment process for fabrication of printed circuit boards in applications demanding the lowest signal loss. This uniquely formulated process, from the market leader of innerlayer technologies, provides low surface profles and reliable adhesion for high frequency applications. M-Speed provides low profle surface topography to ensure maximum signal speeds, meeting the needs of controlled impedance and perfect signal integrity. M-Speed ofers superior adhesion and maximum thermal resistance despite lower surface topography and lower peak to valley roughness

Key Features

  • Exceptional precision for controlled impedance and high frequency designs
  • Superior adhesion for imaging and immerlayer processing
  • Environmentally friendly
  • High reliability on conventional and new laminate systems
  • Low surface profiles

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The M-Speed system achieves this industry-leading performance in as few as three process steps. The process combines a holistic approach for dry flm adhesion and innerlayer bonding including clean, prep and oxide alternative post treatment. This surface allows excellent adhesion to a wide variety of photoresists as well as unparalleled innerlayer bonding strength. M-Speed provides fexibility of processing using environmentally friendly chemistry.

AlphaPREP Oxide Replacement Systems

AlphaPREP peroxide-sulfuric oxide replacement systemshave been specially formulated for low etch/high capacity operations. The systems produce a highly bondable brown conversion coating on copper innerlayers using horizontal equipment by removing only minimal amounts of copper. The conversion coating produced has high acid resistance that eradicates pink ring without the need for an expensive DMAB reducer. In addition, AlphaPREP Oxide Replacement Systems yield exceptional peel strengths and T260 performance with advanced high Tg dielectrics. AlphaPREP Oxide Replacement Systems deliver superior performance at the lowest cost of ownership.

  • AlphaPREP may be used in existing lines with both speed and performance advantages thus eliminating the need to purchase costly new equipment.
  • With high capacity and exceptional stability, AlphaPREP Systems deliver exceptional performance at high copper loadings.
  • Users of AlphaPREP Systems witness a substantial reduction in energy and water usage, as well as simplified wastewater treatment.
  • Compared with existing processes, AlphaPREP Systems deliver a shorter cycle-time thereby increasing productivity, particularly in automatic equipment.

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