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Recent advances in the design and manufacture of leadframe based packages have focused on providing greater I/O at equivalent package size. The latest developments enable systems that rival conventional substrate-based BGA for low to moderate lead count applications.

Wafer Fabrication

MacDermid Enthone ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.

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Wafer Level Packaging

MacDermid Enthone wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.

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IN THE NEWS

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MEES to Present Three Papers at SMTA International Sep 11, 2017, 10:51 AM

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MEES to Showcase at SMTA International 2017 Aug 30, 2017, 2:05 PM

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Compugraphics Receives Supplier of the Year Award by FUJIFILM Dimatix Jul 26, 2017, 5:07 PM

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