MacDermid Enthone ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.Read More
Wafer Level Packaging
MacDermid Enthone wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.Read More
IN THE NEWS
MacDermid Enthone’s Marketing and OEM teams work very closely with the worldwide leaders in Automotive Electronics and Instrumentation to provide consistent and reliably effective…
Companies that are in, or beginning to explore entry into the $10+ billion printed electronics market can look to MacDermid Performance Solutions for across-the-board support.
The communications market has seen significant changes over the last decade. This market is growing rapidly and incorporating more technical changes than any other market.…