Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry. 

Wafer Fabrication

Our ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.

Read More

Wafer Level Packaging

Our wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin-silver bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.

Read More



MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM

Read More

MacDermid Alpha Releases First Processes in New Memory Disk Product Line: Enklad Pretreatment Jan 22, 2020, 11:42 AM

Read More

MacDermid Alpha to Present Original Research at IPC APEX Conference and Expo 2020 Jan 3, 2020, 9:22 AM

Read More