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Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry. 

Wafer Fabrication

Our ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.

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Wafer Level Packaging

Our wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.

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IN THE NEWS

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MACDERMID ALPHA ELECTRONICS SOLUTIONS TO EXHIBIT AT JAPAN’S 49TH INTERNATIONAL ELECTRONIC CIRCUITS EXHIBITION May 16, 2019, 11:37 AM

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MACDERMID ALPHA ANNOUNCES THE RELEASE OF M-CONTACT IN-2000: REEL TO REEL INDIUM PLATING FOR PRESS-FIT CONNECTOR FINISHING Apr 5, 2019, 10:01 AM

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MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

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