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Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry. 

Wafer Fabrication

Our ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.

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Wafer Level Packaging

Our wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.

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IN THE NEWS

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MacDermid Alpha Electronics Solutions Announces the Acquisition of Kester Dec 4, 2019, 8:17 AM

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MultiPrep 200 Soldermask Adhesion Promoter Nov 19, 2019, 10:27 AM

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MacDermid Alpha to Present at IMPACT-IAAC 2019 Conference Oct 3, 2019, 4:35 PM

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