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MacDermid Enthone Advanced Electronics Solutions technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry. 

Wafer Fabrication

MacDermid Enthone ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.

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Wafer Level Packaging

MacDermid Enthone wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.

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IN THE NEWS

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MacDermid Enthone Electronics Solutions appoints Mr. Roger Fontaine to Eastern Region Commercial Team Jun 18, 2018, 4:17 PM

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MacDermid Enthone to Attend PV CellTech Conference in Malaysia Mar 5, 2018, 1:57 PM

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MacDermid Enthone Electronics Solutions to Exhibit at Productronica 2017 Oct 12, 2017, 2:55 PM

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INDUSTRIES SERVED