chips-1.png

Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry. 

Wafer Fabrication

Our ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.

Read More

Wafer Level Packaging

Our wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin-silver bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.

Read More

IN THE NEWS

Picture2.png

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan Sep 3, 2020, 9:42 AM

Read More
Picture2.png

Product Release: MacuSpec THF 100 Mar 31, 2020, 1:45 PM

Read More
Picture1.png

MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM

Read More

INDUSTRIES SERVED