Sulfamate Nickel Process

MICROFAB NI Series are nickel sulfamate electroplating processes that produce pure, ductile, fine-grained, low stress nickel deposits. These high-performing processes easily meet the exacting performance requirements of the semiconductor industry for quality assured wafer plating chemistry.

The MICROFAB NI Series processes contain an anode activating agent in controlled amounts to enhance anode corrosion and prevent anode passivation. Deposit properties are easy to control and maintain.

wafter-formation-content.jpg