Tin-Silver Bump Metallization for Wafer Level Packaging
MICROFAB TS-650 is a high speed, lead-free fine-pitch tin-silver metallization for bump, pillar and capping applications developed by the industry leader in copper pillar plating technologies. Formulated to provide excellent surface morphology before and after reflow, the TS-650 is the solderability solution for a wide range of advanced wafer level packaging designs.
MICROFAB TS-650 Key Features:
- Highly smooth and uniform, lead free deposit
- Excellent morphology pre and post reflow
- Passes HTST 175° C / 10hr
- Suitable for bump, pillar and capping
- High speed plating up to 15 ASD and over 100 AH/L bath life
- Low foam process
Tin Electroplating Process for Semiconductor Applications
MICROFAB SN 300 is a high speed, MSA based process that produces fine-grained, matte to semi-bright pure tin deposits. The process produces wafer bumps with excellent thickness distribution across the wafer, as well as a uniform alloy distribution.
The many benefits of the MICROFAB SN 300 process include:
- Compliance with RoHS & WEEE environmental directives
- Excellent replacement for eutectic 63:37 Tin:Lead
- Suitability for high-speed mass production
- Stability during alloy phases and near zero voiding
- A low alpha emission process
