Tin Electroplating Process for Semiconductor Applications

MICROFAB SN 300 is a high speed, MSA based process that produces fine-grained, matte to semi-bright pure tin deposits. The process produces wafer bumps with excellent thickness distribution across the wafer, as well as a uniform alloy distribution. 

The many benefits of the MICROFAB SN 300 process include:

  • Compliance with RoHS & WEEE environmental directives
  • Excellent replacement for eutectic 63:37 Tin:Lead
  • Suitability for high-speed mass production
  • Stability during alloy phases and near zero voiding
  • A low alpha emission process